Introduction
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Apply heat around the perimeter of the lower case to loosen the adhesive that secures the lower case to the chassis.
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Insert an opening pick in the gap between the lower case and chassis.
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After ensuring that the adhesive is warm, slide the pick around the perimeter to sever the adhesive.
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As you sever the adhesive, insert additional opening picks at each corner to prevent the adhesive from readhering.
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Remove the lower case.
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Conclusion
To reassemble your device, follow these instructions in reverse order.
